CVE-2022-33231: Qualcomm, Inc. Snapdragon, грешка в паметта

Описание

Оригинално описание

Memory corruption due to double free in core while initializing the encryption key.

Засегнати продукти

• Qualcomm, Inc. Snapdragon: 315 5G IoT Modem; 9205 LTE Modem; AQT1000; AR8031; AR8035; C-V2X 9150; CSRA6620; CSRA6640; CSRB31024; FastConnect 6200; FastConnect 6700; FastConnect 6800; FastConnect 6900; FastConnect 7800; Flight RB5 5G Platform; FSM10056; Home Hub 100 Platform; IPQ9008; IPQ9574; MSM8108; MSM8209; MSM8608; QAM8295P; QCA4004; QCA6174A; QCA6310; QCA6320; QCA6335; QCA6391; QCA6420; QCA6421; QCA6426; QCA6430; QCA6431; QCA6436; QCA6564; QCA6564A; QCA6564AU; QCA6574; QCA6574A; QCA6574AU; QCA6595; QCA6595AU; QCA6696; QCA6698AQ; QCA8081; QCA8082; QCA8084; QCA8085; QCA8337; QCA8386; QCA9377; QCA9379; QCA9984; QCM2290; QCM4290; QCM6125; QCM6490; QCN6024; QCN7606; QCN9011; QCN9012; QCN9024; QCN9074; QCN9274; QCS2290; QCS410; QCS4290; QCS610; QCS6125; QCS6490; QCS8155; QRB5165M; QRB5165N; QSM8250; QSM8350; QTS110; Qualcomm 205 Mobile Platform; Qualcomm Robotics RB3 Platform; Qualcomm Robotics RB5 Platform; SA4150P; SA4155P; SA6145P; SA6150P; SA6155; SA6155P; SA8145P; SA8150P; SA8155; SA8155P; SA8195P; SA8295P; SA8540P; SA9000P; SC8180X+SDX55; SD 455; SD 675; SD 8 Gen1 5G; SD 8CX; SD 8cx Gen2; SD 8cx Gen3; SD460; SD660; SD662; SD670; SD675; SD730; SD778G; SD7c; SD835; SD855; SD865 5G; SD888; SDX55; SDX57M; SM4125; SM6250; SM6250P; SM7250P; SM7315; SM7325P; Smart Audio 200 Platform; Smart Audio 400 Platform; Snapdragon 208 Processor; Snapdragon 210 Processor; Snapdragon 212 Mobile Platform; Snapdragon 4 Gen 1 Mobile Platform; Snapdragon 460 Mobile Platform; Snapdragon 480 5G Mobile Platform; Snapdragon 480+ 5G Mobile Platform (SM4350-AC); Snapdragon 630 Mobile Platform; Snapdragon 636 Mobile Platform; Snapdragon 660 Mobile Platform; Snapdragon 662 Mobile Platform; Snapdragon 665 Mobile Platform; Snapdragon 670 Mobile Platform; Snapdragon 675 Mobile Platform; Snapdragon 678 Mobile Platform (SM6150-AC); Snapdragon 680 4G Mobile Platform; Snapdragon 685 4G Mobile Platform (SM6225-AD); Snapdragon 690 5G Mobile Platform; Snapdragon 695 5G Mobile Platform; Snapdragon 710 Mobile Platform; Snapdragon 712 Mobile Platform; Snapdragon 720G Mobile Platform; Snapdragon 730 Mobile Platform (SM7150-AA); Snapdragon 730G Mobile Platform (SM7150-AB); Snapdragon 732G Mobile Platform (SM7150-AC); Snapdragon 750G 5G Mobile Platform; Snapdragon 765 5G Mobile Platform (SM7250-AA); Snapdragon 765G 5G Mobile Platform (SM7250-AB); Snapdragon 768G 5G Mobile Platform (SM7250-AC); Snapdragon 778G 5G Mobile Platform; Snapdragon 778G+ 5G Mobile Platform (SM7325-AE); Snapdragon 780G 5G Mobile Platform; Snapdragon 782G Mobile Platform (SM7325-AF); Snapdragon 8 Gen 1 Mobile Platform; Snapdragon 835 Mobile Platform; Snapdragon 845 Mobile Platform; Snapdragon 850 Mobile Compute Platform; Snapdragon 855 Mobile Platform; Snapdragon 855+/860 Mobile Platform (SM8150-AC); Snapdragon 865 5G Mobile Platform; Snapdragon 865+ 5G Mobile Platform (SM8250-AB); Snapdragon 870 5G Mobile Platform (SM8250-AC); Snapdragon 888 5G Mobile Platform; Snapdragon 888+ 5G Mobile Platform (SM8350-AC); Snapdragon AR2 Gen 1 Platform; Snapdragon Auto 5G Modem-RF; Snapdragon W5+ Gen 1 Wearable Platform; Snapdragon Wear 1300 Platform; Snapdragon X24 LTE Modem; Snapdragon X50 5G Modem-RF System; Snapdragon X55 5G Modem-RF System; Snapdragon X65 5G Modem-RF System; Snapdragon X70 Modem-RF System; Snapdragon XR1 Platform; Snapdragon XR2 5G Platform; Snapdragon XR2+ Gen 1 Platform; Snapdragon Auto 4G Modem; SSG2115P; SSG2125P; SW5100; SW5100P; SXR1120; SXR1230P; SXR2130; SXR2230P; Vision Intelligence 300 Platform; Vision Intelligence 400 Platform; WCD9306; WCD9326; WCD9335; WCD9340; WCD9341; WCD9360; WCD9370; WCD9371; WCD9375; WCD9380; WCD9385; WCN3610; WCN3615; WCN3660B; WCN3680B; WCN3910; WCN3950; WCN3980; WCN3988; WCN3990; WCN3999; WCN6740; WSA8810; WSA8815; WSA8830; WSA8832; WSA8835

Вид слабост

• CWE-415 Двойно освобождаване на памет (Double Free)

История

Други уязвимости в Qualcomm, Inc. Snapdragon

• 7.8CVE-2026-57559
• 7.8CVE-2026-57555
• 7.8CVE-2026-57554
• 7.5CVE-2026-57546
• 7.8CVE-2026-57545

Първоизточници

• https://www.cve.org/CVERecord?id=CVE-2022-33231
• https://nvd.nist.gov/vuln/detail/CVE-2022-33231
• https://www.qualcomm.com/company/product-security/bulletins/april-2023-bulletin