CVE-2022-22096: Qualcomm, Inc. Snapdragon Connectivity, Snapdragon

Описание

Оригинално описание

Memory corruption in Bluetooth HOST due to stack-based buffer overflow when when extracting data using command length parameter in Snapdragon Connectivity, Snapdragon Mobile

Засегнати продукти

• Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Mobile: AQT1000, QCA6390, QCA6391, SD 675, SD 8 Gen1 5G, SD460, SD480, SD662, SD665, SD675, SD678, SD680, SD690 5G, SD695, SD720G, SD730, SD765, SD765G, SD768G, SD778G, SD780G, SD855, SD865 5G, SD870, SD888, SD888 5G, SDX55M, SM6250, SM7250P, SM7315, SM7325P, SM7450, SM8475, SM8475P, WCD9341, WCD9370, WCD9375, WCD9380, WCD9385, WCN3950, WCN3980, WCN3988, WCN3991, WCN3998, WCN6740, WCN6750, WCN6850, WCN6851, WCN6855, WCN6856, WCN7850, WCN7851, WSA8810, WSA8815, WSA8830, WSA8832, WSA8835

История

Други уязвимости в Qualcomm, Inc. Snapdragon Connectivity, Snapdragon Mobile

• 9.8CVE-2022-25708
• 8.4CVE-2022-25693
• 6.8CVE-2021-35109
• 6.8CVE-2021-35108
• 8.4CVE-2021-35095

Първоизточници

• https://www.cve.org/CVERecord?id=CVE-2022-22096
• https://nvd.nist.gov/vuln/detail/CVE-2022-22096
• https://www.qualcomm.com/company/product-security/bulletins/july-2022-bulletin